Eoptolink has one of the biggest automatic TO packaging and testing lines in China to provide services for optoelectronics components companies. We have recruited the professional team members in this field with the best machines and devices in the world plus unique tooling that developed in house. Eoptolink is capable of providing very high precise packaging and testing services in high volumes.

The term Transistor Outline package (more commonly referred to as TO),always consists of two components: a TO header and a TO cap. While the TO header makes sure that the encapsulated components are provided with power, the cap ensures the smooth transmission of optical signals. This includes the transmitters (e.g. laser diodes) as well as the receivers of the optical signals (e.g. photodiodes).

The TO header provides a mechanical basis for the installation of electronic and optical components such as semiconductors, laser diodes or simple electronic circuits, while at the same time providing power to the encapsulated components with the aid of pins. Optical components in TO packages such as photodiodes and laser diodes are particularly susceptible to damage from their environment. Humidity in particular, can cause semiconductor elements to corrode rapidly, leading to failure of the entire component. This is why these TO header components require reliable and permanent protection.